Reflow Oven Soldering Convection SMT Oven Model RF100

The RF100 Convection Soldering Reflow Oven is a practical benchtop size reflow oven for  the manufacturing and reworking of SMT products.  The Reflow oven has a large intuitive graphical display.  The intuitive menu navigation is controlled by a membrane keypad.  The Benchtop Reflow oven uses highly efficient infrared heating elements, and has several thermocouple temperature gauges.  Due to this and the precise evaluation by the microprocessor, the temperature curve of the reflow process is very precise, and the temperature in the respective reflow sections is very uniform. The Desktop RF100 Batch PCB Solder Reflow oven has been designed for the reflow of all common high temperature alloys, including both Lead and Lead free solder paste creams which can be processed to facilitate the mounting of SMD (Surface Mount Devices).  The Reflow oven has an automatic error detection function with alarm.  There is a software package included that allows remote programming and real time monitoring and control of the oven via a Windows PC.  This software is a very useful aid for Thermal profiling. This product has a variety of applications such as reflow soldering, repairing, prototyping, drying, gluing and so on.  It is suitable for SMT small series, for research and development of electronic products, school, education and study.  We recommend using the oven with a suitable fume extraction station such as the EX101 The Batch Reflow stove is very well insulated by a special Aluminum silicate cotton, which reduces energy consumption, protects the circuit and allows optimal operation and keeps the temperature within the oven uniform and constant. Features:- Designed for re-flow of solder paste or for polymerisation of prototyping glues Heating system makes designed for Lead and lead-free and high temperature alloys Large window panel keeps Circuit Board in view during processing Software package included to allow programming, control and monitoring of the Reflow oven from a PC Workstation Suitable for re-flow of both Single and Double Sided Circuit boards Compact housing design with generous 350x300mm working area and a maximum working height of 80mm 5 Programmable phases for the re-flow process Constant heat mode option where the oven will stay on indefinitely at a pre programmed constant temperature Suitable for processing of both Single and double sided designed PCB SMT boards 4 Program memory complete with LCD Graphical display for temperature & time Simple programming for intuitive control Heating through forced air convection Utilises 4 x Infrared quartz heating elements Software to allow real time Thermal Profiling, control and monitoring of the oven via a Window PC connected over a USB serial lead Microprocessor controlled temperature up to maximum 300°C Thermic stabilisation time is approx. 3 minutes <50dBA Noise level 230VAC Mains powered, 50/60Hz Single Phase IEC Inlet As part of the SMT process the temperature profile must be programmed with the correct time and temperature parameters to suit the particular Thermal profile of the alloy composition of Solder paste being used.  To achieve this there are 5 Fully Programmable Re-flow phases which briefly comprise:-  Preheating (Ramp up to Soak) – Circuit board is heated from room temperature to remove residual moisture or gases and reduce thermal stress on the circuit board.  Heating (Thermal Soak) – Circuit board is heated further until the flux contained in the Solder paste becomes liquid. Soldering (Re-flow Zone) -In this phase the solder should become liquid such that components float and automatically center and align with the surface tension of the liquid solder. Hold Dwell Time – This is particularly useful for high temperature solders to allow solidification to occur slowly.  Generally the temperature is set at 10-20 Degrees lower than the solder melting point. Cooling Zone – Oven is no longer heated and natural cooling is accelerated by a fan.   Technical Specifications   Power connection 200 – 230 VAC. / 50-60Hz IEC Inlet 120VAC Adapter Available Max. Power Consumption 2400 W Sliding Draw Max. PCB-Board Size 350 x 300 mm (Maximum height of drawer 85mm) All Phases can have Time duration set between   0-99 Minutes  Programmable in increments of 1 second (00.00– 99:59)   Temperature 60 -300 °C Ramp up heating rate 2 Degrees/Second Setting Options 5 Phases all adjustable both in time and temperature:- 1.Preheat 2.Heat 3.Soldering 4.Holding 5.Cool down Constant heat mode (Oven will stay on indefinitely at a set temperature) Working Modes Automatic Re-flow-Soldering Permanent Heating or Drying function Option to store 4 different Re-flow profiles Interface Graphic display with Keyboard automatic Alarm function Display of Process progress Heat up Time Approximately 8 min External Dimensions  of re-flow oven chassis (LxWxH) (mm) 504 x 500 x 314 mm Weight 25 kg Shipping Dimensions                                                   57 x 54 x 39cm Shipping Weight                                                            28Kg